Semiconductor memory

ABSTRACT

A semiconductor memory includes first to fourth stacked bodies. The first stacked body includes a first conductor, and an alternating stack of first insulators and second conductors above the first conductor in a region. The second stacked body includes a third conductor, and an alternating stack of second insulators and fourth conductors above the third conductor in another region. The third stacked body includes a fifth conductor adjacent to the first conductor via a third insulator in a separation region. The fourth stacked body includes a seventh conductor adjacent to the third conductor via a fifth insulator in the separation region. The fifth conductor is electrically insulated from the seventh conductor.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/287,233, filed on Feb. 27, 2019, which is based upon and claims thebenefit of priority from Japanese Patent Application No. 2018-105291,filed on May 31, 2018, the entire contents of each of which areincorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor memory.

BACKGROUND

A NAND flash memory capable of storing data in a nonvolatile manner isknown.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a semiconductor memory accordingto an embodiment.

FIG. 2 is a circuit diagram illustrating an example of a circuitconfiguration of a memory cell array of the semiconductor memoryaccording to the embodiment.

FIG. 3 illustrates a plan view of an example of the memory cell array ofthe semiconductor memory according to the embodiment.

FIG. 4 illustrates a plan view of an example of the memory cell array ofthe semiconductor memory according to the first embodiment.

FIG. 5 illustrates a plan view of an example of a cell region of thememory cell array of the semiconductor memory according to theembodiment.

FIG. 6 illustrates a plan view of an example of the cell region of thememory cell array of the semiconductor memory according to theembodiment.

FIG. 7 illustrates a cross-sectional view of an example of the cellregion of the memory cell array of the semiconductor memory according tothe embodiment.

FIG. 8 illustrates a cross-sectional view of an example of a memorypillar in the semiconductor memory according to the first embodiment.

FIG. 9 illustrates a cross-sectional view of an example of the cellregion of the memory cell array of the semiconductor memory according tothe embodiment.

FIG. 10 illustrates a plan view of an example of a lead region of thememory cell array of the semiconductor memory according to theembodiment.

FIG. 11 illustrates a cross-sectional view of an example of the leadregion of the memory cell array of the semiconductor memory according tothe embodiment.

FIG. 12 illustrates a cross-sectional view of an example of the leadregion of the memory cell array of the semiconductor memory according tothe embodiment.

FIG. 13 illustrates a plan view of an example of the vicinity of a planeseparation region of the semiconductor memory according to theembodiment.

FIG. 14 illustrates a plan view of an example of the vicinity of theplane separation region of the semiconductor memory according to theembodiment.

FIG. 15 illustrates a cross-sectional view of an example of the memorycell array in a region including a dummy block and a peripheral regionof a block group in the semiconductor memory according to theembodiment.

FIG. 16 illustrates a plan view of an example of the memory cell arrayaccording to of the embodiment.

FIG. 17 illustrates a cross-sectional view of a source line portionillustrating an example of a method of forming a source line in thesemiconductor memory according to the embodiment.

FIG. 18 illustrates a plan view of an example of a memory cell array ina first modification example of the embodiment.

FIG. 19 illustrates a plan view of an example of the vicinity of a planeseparation region in the first modification example of the embodiment.

FIG. 20 illustrates a plan view of an example of a memory cell array ina second modification example of the embodiment.

FIG. 21 illustrates a plan view of an example of the vicinity of a planeseparation region in the second modification example of the embodiment.

DETAILED DESCRIPTION

Embodiments provide a semiconductor memory capable of improvingreliability of data stored in a memory cell.

In general, according to an embodiment, a semiconductor memory includesa substrate, and first to fourth stacked bodies. First to seventhregions are provided in this order along a direction parallel to asurface of the substrate. The first stacked body includes a firstconductor and an alternating stack of first insulators and secondconductors above the first conductor, in the first to third regions. Thesecond stacked body includes a third conductor and an alternating stackof second insulators and fourth conductors above the third conductor, inthe fifth to seventh regions. A columnar first contact is provided onone of the second conductors closest to the first conductor in the firstregion. A columnar second contact is provided on one of the fourthconductors closest to the third conductor in the seventh region. Aplurality of first pillars is provided, and each of the first pillarsextends through the first stacked body in the second region, and hasmemory cell regions at intersections with the second conductors. Aplurality of second pillars is provided, and each of the second pillarsextends through the second stacked body in the sixth region, and hasmemory cell regions at intersections with the fourth conductors. Thethird stacked body includes a fifth conductor at a same layer level asthe first conductor and adjacent to the first conductor via a thirdinsulator and an alternating stack of fourth insulators and sixthconductors above the fifth conductor, in the fourth region. The fourthstacked body includes a seventh conductor at a same layer level as thesecond conductor and adjacent to the third conductor via a fifthinsulator and an alternating stack of sixth insulators and eighthconductors above the seventh conductor, in the fourth region. The fifthconductor is electrically insulated from the seventh conductor.

In the following, embodiments will be described with reference to thedrawings. Each embodiment exemplifies a device or a method for embodyingthe technical concept of the present disclosure. The drawings areschematic or conceptual, and a dimension and a proportion in eachdrawing cannot be said to be the same as actual ones. The technicalconcept of the present disclosure is not specified by a shape, astructure, a disposition, and the like of an element.

In the following description, elements having the substantially samefunction and configuration are given the same reference numeral. Numbersafter a letter forming a reference sign are referred to by a referencesign including the same letter, and are used to differentiate elementshaving the same configuration. Similarly, letters after a number forminga reference sign are referred to by a reference sign including the samenumber, and are used to differentiate elements having the sameconfiguration. In a case where elements indicated by reference signsincluding the same letter or number are not required to bedifferentiated from each other, such elements are referred to by areference sign including only the letter or the number.

1. Embodiment

In the following, a semiconductor memory 1 according to an embodimentwill be described.

1-1. Configuration of Semiconductor Memory 1

1-1-1. Overall Configuration of Semiconductor Memory 1

The semiconductor memory 1 is, for example, a NAND flash memory capableof storing data in a nonvolatile manner. The semiconductor memory 1 iscontrolled by, for example, an external memory controller 2. FIG. 1illustrates a configuration example of the semiconductor memory 1according to the embodiment.

As illustrated in FIG. 1, the semiconductor memory 1 includes, forexample, memory cell arrays 10A and 10B, a command register 11, anaddress register 12, a sequencer 13, a driver module 14, row decodermodules 15A and 15B, and sense amplifier modules 16A and 16B.

In the following, a set of the memory cell array 10A, the row decodermodule 15A, and the sense amplifier module 16A will be referred to as aplane PN1. A set of the memory cell array 10B, the row decoder module15B, and the sense amplifier module 16B will be referred to as a planePN2.

Each of the memory cell arrays 10A and 10B stores data in a nonvolatilemanner. A plurality of bit lines and a plurality of word lines areprovided in each of the memory cell arrays 10A and 10B. Each of thememory cell arrays 10A and 10B includes a plurality of blocks BLK0 toBLKn (where n is an integer of 1 or greater). The block BLK is anaggregate of nonvolatile memory cells, and is used as, for example, adata erase unit. Each memory cell is associated with a single bit lineand a single word line. A detailed configuration of the memory cellarray 10 will be described later.

The command register 11 stores a command CMD which is received from thememory controller 2 by the semiconductor memory 1. The command CMDincludes, for example, commands for causing the sequencer 13 to performa read operation, a write operation, an erase operation, and the like.

The address register 12 stores address information ADD which is receivedfrom the memory controller 2 by the semiconductor memory 1. The addressinformation ADD includes, for example, a block address BAd, a pageaddress PAd, and a column address CAd. For example, the block addressBAd, the page address PAd, and the column address CAd are respectivelyused to select the block BLK, a word line, and a bit line.

The sequencer 13 controls the overall operation of the semiconductormemory 1. The sequencer 13 can separately control the plane PN1 and theplane PN2. For example, the sequencer 13 controls the driver module 14and the plane PN1 based on the command CMD stored in the commandregister 11, so as to perform a read operation, a write operation, anerase operation, and the like on the plane PN1. Similarly, the sequencer13 may perform a read operation, a write operation, an erase operation,and the like on the plane PN2.

The driver module 14 generates voltages used for a read operation, awrite operation, an erase operation, and the like. The driver module 14applies a generated voltage to, for example, a signal line correspondingto a selected word line based on the page address PAd stored in theaddress register 12.

The row decoder modules 15A and 15B are provided corresponding to thememory cell arrays 10A and 10B respectively. The row decoder module 15selects one block BLK in the corresponding memory cell array 10 based onthe block address BAd stored in the address register 12. The row decodermodule 15 transmits the voltage applied to the signal line correspondingto the selected word line, to the selected word line in the selectedblock BLK.

The sense amplifier modules 16A and 16B are provided corresponding tothe memory cell arrays 10A and 10B respectively. In a write operation,the sense amplifier module 16 applies a desired voltage to a bit lineprovided in the corresponding memory cell array 10 according to writedata DAT received from the memory controller 2. In a read operation, thesense amplifier module 16 determines data stored in a memory cell basedon a voltage of a bit line, reads a determination result, and transmitsthe determination result to the memory controller 2 as the data DAT.

Communication between the semiconductor memory 1 and the memorycontroller 2 is performed based on, for example, a NAND interfacestandard. For example, a command latch enable signal CLE, an addresslatch enable signal ALE, a write enable signal WEn, a read enable signalREn, a ready/busy signal RBn, and an input/output signal I/O are used incommunication between the semiconductor memory 1 and the memorycontroller 2.

The command latch enable signal CLE is a signal indicating that theinput/output signal I/O received by the semiconductor memory 1 is thecommand CMD. The address latch enable signal ALE is a signal indicatingthat the input/output signal I/O received by the semiconductor memory 1is the address information ADD. The write enable signal WEn is a signalfor instructing the semiconductor memory 1 to input the input/outputsignal I/O. The read enable signal REn is a signal for instructing thesemiconductor memory 1 to output the input/output signal I/O.

The ready/busy signal RBn is a signal for notifying the memorycontroller 2 whether the semiconductor memory 1 is in a ready state ofreceiving a command from the memory controller 2 or in a busy state ofnot receiving a command. The input/output signal I/O is, for example, asignal with an 8-bit width, and may include the command CMD, the addressinformation ADD, the data DAT, and the like.

A single semiconductor device may be configured through a combination ofthe semiconductor memory 1 and the memory controller 2. Such asemiconductor device may include, for example, a memory card such as anSD™ card, or a solid state drive (SSD).

The embodiment shows the semiconductor memory 1 having two planes(planes PN1 and PN2). Alternatively, the semiconductor memory 1 mayinclude three or more planes. A configuration of a plane is not limitedto the above-described configuration, and a plane may include at leastthe memory cell array 10.

1-1-2. Circuit Configuration of Semiconductor Memory 1

FIG. 2 illustrates an example of a circuit configuration of the memorycell array 10 of the semiconductor memory 1 according to the embodimentby extracting one block BLK from a plurality of blocks BLK in the memorycell array 10.

As illustrated in FIG. 2, the block BLK includes, for example, fourstring units SU0 to SU3. Each string unit SU includes a plurality ofNAND strings NS respectively associated with bit lines BL0 to BLm (wherem is an integer of 1 or greater).

The NAND string NS includes, for example, memory cell transistors MT0 toMT7, and select transistors ST1 and ST2. The select transistor ST1 is,for example, a set of select transistors ST1 a, ST1 b, and ST1 c whichare connected in series to each other. The select transistor ST1 may bedesigned to have any number of transistors.

The memory cell transistor MT includes a control gate and a chargestorage layer, and stores data in a nonvolatile manner. Each of theselect transistors ST1 and ST2 is used to select the string unit SUduring various operations.

In each NAND string NS, the memory cell transistors MT0 to MT7 areconnected in series to each other between a source of the selecttransistor ST1 a and a drain of the select transistor ST2. The controlgates of the memory cell transistors MT0 to MT7 in the identical blockBLK are respectively connected in common to the word lines WL0 to WL7.

In each NAND string NS, a drain of the select transistor ST1 c isconnected to the corresponding bit line BL. In other words, one end ofthe select transistor ST1 is connected to one end of the memory celltransistors MT0 to MT7 connected in series to each other, and the otherend of the select transistor ST1 is connected to the corresponding bitline BL.

Gates of the select transistors ST1 a, ST1 b, and ST1 c in the stringunit SU0 are respectively connected in common to select gate linesSGDa0, SGDb0, and SGDc0. Gates of the select transistors ST1 a, ST1 b,and ST1 c in the string unit SU1 are respectively connected in common toselect gate lines SGDa1, SGDb1, and SGDc1.

Gates of the select transistors ST1 a, ST1 b, and ST1 c in the stringunit SU2 are respectively connected in common to select gate linesSGDa2, SGDb2, and SGDc2. Gates of the select transistors ST1 a, ST1 b,and ST1 c in the string unit SU3 are respectively connected in common toselect gate lines SGDa3, SGDb3, and SGDc3.

Sources of the select transistor ST2 in the identical block BLK areconnected in common to a source line SL. Gates of the select transistorsST2 in the identical block BLK are connected in common to a select gateline SGS.

In the circuit configuration of the memory cell array 10 describedabove, drains of the select transistors ST1 c corresponding to anidentical column among a plurality of blocks BLK are connected to theidentical bit line BL. The source line SL is connected in common to, forexample, the plurality of blocks BLK.

A plurality of memory cell transistors MT connected to a common wordline WL in a single string unit SU will be referred to as, for example,a cell unit CU. A storage capacity of each cell unit CU changes based onthe number of bits of data stored in the memory cell transistor MT.

For example, a single cell unit CU may store 1-page data in a case whereeach memory cell transistor MT stores 1-bit data, and may store 2-pagedata in a case where each memory cell transistor MT stores 2-bit data.

As described above, “1-page data” is defined by a total amount of datastored in the cell unit CU configured with the memory cell transistorsMT each storing 1-bit data.

A circuit configuration of the memory cell array 10 of the semiconductormemory 1 according to the embodiment is not limited to theabove-described configuration. For example, each NAND string NS may bedesigned to have any number of memory cell transistors MT and selecttransistors ST1 and ST2. Each block BLK may be designed to have anynumber of string units SU.

1-1-3. Structure of Semiconductor Memory 1

In the following, a description will be made of an example of astructure of the semiconductor memory 1 according to the embodiment. Thesemiconductor memory 1 according to the embodiment has a structure inwhich circuits such as the sense amplifier module 16 are providedbetween a semiconductor substrate and the memory cell array 10, that is,under the memory cell array 10.

In the drawings referred to below, an X direction corresponds to anextension direction of the word line WL, a Y direction corresponds to anextension direction of the bit line BL, and a Z direction corresponds toa vertical direction to a front surface of a semiconductor substrate 20on which the semiconductor memory 1 is formed.

In cross-sectional views referred to below, for better understanding ofthe drawings, elements such as an insulating layer (interlayerinsulating film), a wiring, and a contact are not illustrated asappropriate. In plan views, for better understanding of the views,hatching is added as appropriate. Hatching added to the plan views isnot necessarily associated with a material or a characteristic of ahatched element.

Planar Layout of Memory Cell Arrays 10A and 10B

FIG. 3 illustrates an example of a planar layout of the memory cellarrays 10A and 10B of the semiconductor memory 1 according to theembodiment.

As illustrated in FIG. 3, a region of the memory cell array 10Acorresponding to the plane PN1 and a region of the memory cell array 10Bcorresponding to the plane PN2 are adjacent to each other in the Xdirection. A plane separation region PNdiv is provided between theregion of the memory cell array 10A and the region of the memory cellarray 10B.

Each of the regions corresponding to the memory cell arrays 10A and 10Bmay be divided into, for example, a cell region CA, a lead region HA,and a C4 connection region C4tap along the X direction. Specifically,the cell region CA (e.g., a first region), the lead region HA (e.g., asecond region), and the C4 connection region C4tap (e.g., a thirdregion) of the memory cell array 10A, the plane separation region PNdiv,and the C4 connection region C4tap (e.g., a fourth region), the leadregion HA (e.g., a fifth region), and the cell region CA (e.g., a sixthregion) of the memory cell array 10B are arranged in order in the Xdirection. In an embodiment, the lead region HA and the cell region CAof the memory cell array 10A may be referred to as first and secondregions, respectively, and the cell region CA and the lead region HA ofthe memory cell array 10B may be referred to as third and fourthregions, respectively.

The cell region CA is a region in which a plurality of NAND strings NSare formed. The lead region HA is a region in which contacts forelectrically connecting select gate lines SGD and SGS and the word linesWL connected to the NAND strings NS to the row decoder module 15 areformed. The C4 connection region C4tap is a region in which contacts forelectrically connecting, for example, the source line SL connected tothe NAND string NS or a power line or a signal line provided on thememory cell array 10 to circuits provided under the memory cell array 10are formed.

Each of the C4 connection region C4tap of the memory cell array 10A andthe C4 connection region C4tap of the memory cell array 10B is incontact with the plane separation region PNdiv. Each of the lead regionHA of the memory cell array 10A and the lead region HA of the memorycell array 10B is separated from the plane separation region PNdiv. Ineach of the memory cell arrays 10A and 10B, the cell region CA isdisposed between the lead region HA and the C4 connection region C4tap.

Each of the memory cell arrays 10A and 10B includes, for example, blockgroups BLKG0 to BLKG3. Each block group BLKG extends in the X direction,and the block groups BLKG0 to BLKG3 are arranged in the Y direction.Each memory cell array 10 may be designed to have any number of blockgroups BLKG. The block group BLKG includes a plurality of blocks BLK.For example, a BL connection region BLtap is provided between the blockgroups BLKG adjacent to each other in the cell region CA.

The BL connection region BLtap is a region in which a contact forelectrically connecting the bit line BL connected to the NAND string NSto the sense amplifier module 16 disposed under the memory cell array 10is formed.

FIG. 4 illustrates an example of a more detailed planar layout of thememory cell array 10 of the semiconductor memory 1 according to theembodiment by extracting a single block group BLKG provided in thememory cell array 10A.

As illustrated in FIG. 4, the block group BLKG includes, for example,four active blocks ABLK and two dummy blocks DBLK.

The active block ABLK is the block BLK used to store data. The totalnumber of active blocks ABLK in each memory cell array 10 corresponds tothe total number of blocks BLK in each memory cell array 10.

The dummy block DBLK is the block BLK not used to store data. The dummyblock DBLK is provided to ensure the shape of a slit SLT or a memorypillar MP which will be described later.

Each of the active block ABLK and the dummy block DBLK extends in the Xdirection. The four active blocks ABLK are arranged in the Y direction,and are disposed between the two dummy blocks DBLK.

Each of the active block ABLK and the dummy block DBLK is provided in,for example, a region of which two sides are in contact with a slit SLT(in the following, referred to as a horizontal-direction slit SLT)extending in the X direction and one side is in contact with a slit SLT(in the following, referred to as a vertical-direction slit SLT)extending in the Y direction.

Specifically, the vertical-direction slit SLT is provided at one endpart of the block group BLKG in the X direction. A plurality ofhorizontal-direction slits SLT arranged in the Y direction are incontact with the vertical-direction slit SLT provided at the one endpart.

In other words, the slit SLT is provided in a comb shape of which theother end part is open in the X direction. The dummy block DBLK or theactive block ABLK is provided in a region between thehorizontal-direction slits SLT adjacent to each other among a pluralityof slits SLT provided in the comb-shaped slit SLT and arranged in the Ydirection.

The vertical-direction slit SLT may be provided at the other end part ofthe block group BLKG in the X direction. In this case, a plurality ofhorizontal-direction slits SLT arranged in the Y direction may be incontact with or separated from the vertical-direction slit SLT at theother end part.

In the active block ABLK, for example, the horizontal-direction slit SLTwhich extends from the lead region HA to the C4 connection region C4tapin the X direction is provided in the region between thehorizontal-direction slits SLT adjacent to each other. Thehorizontal-direction slit SLT has a slit separation part DJ in the leadregion HA. For example, a slit SHE extending in the X direction isdisposed between the horizontal-direction slits SLT arranged in the Ydirection. In the active block ABLK, the slit SHE extends, for example,from the vicinity of the slit separation part DJ of the lead region HAto the C4 connection region C4tap.

In the dummy block DBLK, a region between the horizontal-direction slitsSLT adjacent to each other includes the horizontal-direction slit SLTextending from the lead region HA to the C4 connection region C4tap inthe X direction, for example, in the same manner as in the active blockABLK. A slit SHE extending in the X direction is disposed between thehorizontal-direction slits arranged in the Y direction, for example, inthe same manner as in the active block ABLK.

In the present specification, the peripheral region of the block groupBLKG corresponds to a region adjacent to the dummy block DBLK via thehorizontal-direction slit SLT provided outside the block group BLKG. Inthe slit separation part SLTdiv, a conductor in the dummy block DBLK iselectrically connected to a conductor in the peripheral region of theblock group BLKG.

Each block group BLKG may be designed to have any number of activeblocks ABLK and dummy blocks DBLK, respectively. The dummy block DBLKmay be disposed between the active blocks ABLK arranged in the Ydirection.

The number of horizontal-direction slits SLT in the respective regionsof the active block ABLK and the dummy block DBLK may differ between theactive block ABLK and the dummy block DBLK.

Structure of Memory Cell Array 10 in Cell Region CA

FIG. 5 illustrates an example of a planar layout of the cell region CAof the memory cell array 10 of the semiconductor memory 1 according tothe embodiment by extracting one active block ABLK and one dummy blockDBLK.

As illustrated in FIG. 5, in the cell region CA, the memory cell array10 includes a plurality of memory pillars MP and a plurality of dummymemory pillars DMP. Specifically, in the active block ABLK, a pluralityof memory pillars MP are arranged in a zigzag form between the slits SLTand SHE. For example, the dummy memory pillars DMP are disposed tooverlap the slit SHE.

The memory pillar MP functions as, for example, a single NAND string NS.The dummy memory pillar DMP is a structural body which has the samestructure as, for example, that of the memory pillar MP but is not usedto store data.

For example, in the active block ABLK, an aggregate of a plurality ofmemory pillars MP provided between the slits SLT and SHE adjacent toeach other corresponds to a single string unit SU. In other words, inthe active block ABLK, the string unit SU extends in the X direction.For example, the string units SU0 to SU3 are arranged in the Ydirection.

The rest of the planar layout of the dummy block DBLK in the cell regionCA is the same as, for example, the planar layout of the active blockABLK, and thus a description thereof will be omitted.

FIG. 6 illustrates an example of a more detailed planar layout of thecell region CA of the memory cell array 10 of the semiconductor memory 1according to the embodiment by extracting the string units SU0 and SU1of the active block ABLK.

As illustrated in FIG. 6, a plurality of bit lines BL and a plurality ofcontacts CH are disposed in the memory cell array 10 in correspondenceto the memory pillars MP described with reference to FIG. 5.

Specifically, each of the plurality of bit lines BL extends in the Ydirection, and the plurality of bit lines BL are arranged in the Xdirection. The plurality of contacts CH are provided between each bitline BL and the memory pillars MP corresponding to the bit line BL.

For example, each memory pillar MP overlaps two bit lines BL. Eachmemory pillar MP is electrically connected to a single bit line BL amonga plurality of overlapping bit lines BL, via the columnar contact CH.

The number of bit lines BL overlapping the memory pillar MP may bedesigned to be any number. Each memory pillar MP may be electricallyconnected to a single bit line BL among a plurality of overlapping bitlines BL, via the columnar contact CH.

FIG. 7 illustrates a cross-sectional view of the memory cell array 10taken along the line VII-VII in FIG. 6, and illustrates an example of across-sectional structure of the memory cell array 10 in a regioncorresponding to the active block ABLK in the cell region CA.

As illustrated in FIG. 7, the region corresponding to the active blockABLK in the cell region CA includes, for example, conductors 21A and21B, and 22 to 25, the memory pillars MP, the dummy memory pillars DMP,the contacts CH, and the slits SLT and SHE.

The conductor 21A is provided on the semiconductor substrate 20 via aninsulating layer. The conductor 21B is provided on the conductor 21A,and the conductors 21A and 21B are electrically connected to each other.The conductors 21A and 21B are formed, for example, in a plate shapewhich spreads along an XY plane, and are used as the source line SL.Each of the conductors 21A and 21B is, for example, poly-silicon (Si)doped with phosphor. The conductors 21A and 21B may be integrallyformed.

For example, circuits (not illustrated) such as the row decoder module15 or the sense amplifier module 16 are provided in a region between thesemiconductor substrate 20 and the conductor 21A, that is, under thememory cell array 10.

The conductor 22 is provided on the conductor 21B via an insulatinglayer (e.g., an insulating layer 26 in FIGS. 11 and 14). The conductor22 is formed, for example, in a plate shape which spreads along the XYplane, and is used as the select gate line SGS. The conductor 22 is, forexample, poly-silicon (Si) doped with phosphor.

An insulating layer (e.g., an insulating layer 26 in FIGS. 11 and 14)and the conductor 23 are alternately stacked on the conductor 22. Theconductor 23 is formed, for example, in a plate shape which spreadsalong the XY plane. The plurality of stacked conductors 23 arerespectively used as the word lines WL0 to WL7 in this order from thesemiconductor substrate 20 side. The conductor 23 contains, for example,tungsten (W). In the following, the region in which the conductor 23 isprovided will also be referred to as a W region.

An insulating layer (e.g., an insulating layer 26 in FIGS. 11 and 14)and the conductor 24 are alternately stacked on the conductor 23. Theconductor 24 is formed, for example, in a plate shape which spreadsalong the XY plane. The plurality of stacked conductors 24 arerespectively used as the select gate lines SGDa to SGDc in this orderfrom the semiconductor substrate 20 side. The conductor 24 contains, forexample, tungsten (W).

The conductor 25 is provided on the conductor 24 via an insulating layer(e.g., an insulating layer 26 in FIGS. 11 and 14). The conductor 25 isformed, for example, in a linear shape extending in the Y direction, andis used as the bit line BL. In other words, a plurality of conductors 25are arranged in the X direction in a region (not illustrated). Theconductor 25 contains, for example, copper (Cu).

The memory pillar MP is formed in a columnar shape extending in the Zdirection, and penetrates through, for example, the conductors 22 to 24.Specifically, for example, the upper end of the memory pillar MP isplaced in a layer between the layer in which the conductor 24 isprovided and the layer in which the conductor 25 is provided. A lowerend of the memory pillar MP is included in, for example, the layer inwhich the conductor 21A is provided. In other words, the lower end ofthe memory pillar MP is in contact with the conductor 21A instead ofpenetrating through the conductor 21A.

The memory pillar MP includes, for example, a core member 30, aconductor 31, and a stacked film 32. The core member 30 is formed in acolumnar shape extending in the Z direction. For example, the upper endof the core member 30 is placed in a layer between the layer in whichthe uppermost conductor 24 is provided and the upper end of the memorypillar MP. The lower end of the core member 30 is placed in, forexample, the layer in which the conductor 21A is provided. The coremember 30 contains an insulator such as silicon dioxide (SiO₂).

The core member 30 is covered with the conductor 31. The conductor 31has a portion in contact with the conductor 21A in the layer in whichthe conductor 21A is provided, and is electrically connected to theconductor 21A. The conductor 31 is, for example, poly-silicon (Si). Aside surface and a lower surface of the conductor 31 are covered withthe stacked film 32 except for a portion thereof where the conductors21A and 31 are in contact with each other.

FIG. 8 illustrates an example of a cross-sectional structure of thememory pillar MP in a section parallel to a front surface of thesemiconductor substrate 20, including the conductor 23 used as the wordline WL.

As illustrated in FIG. 8, the core member 30 is provided at the centerof the memory pillar MP in the layer including the conductor 23. Theconductor 31 covers the side surface of the core member 30. The stackedfilm 32 covers the side surface of the conductor 31. The stacked film 32includes, for example, a tunnel oxide film 33, an insulating film 34,and a block insulating film 35.

The tunnel oxide film 33 covers the side surface of the conductor 31.The insulating film 34 covers a side surface of the tunnel oxide film33. The block insulating film 35 covers a side surface of the insulatingfilm 34. The conductor 23 covers a side surface of the block insulatingfilm 35.

Referring to FIG. 7 again, the columnar contact CH is provided on anupper surface of the memory pillar MP, that is, on the conductor 31. Anupper surface of the contact CH is in contact with a single conductor25, that is, a single bit line BL.

The dummy memory pillars DMP is formed in a columnar shape extending inthe Z direction, and penetrates through, for example, the conductors 22to 24. A configuration of the dummy memory pillars DMP is the same as,for example, the configuration of the memory pillar MP, and thus adescription thereof will be omitted.

The slit SLT is formed in a plate shape spreading along an XZ plane, andseparates, for example, the conductors 22 to 24. Specifically, the upperend of the slit SLT is placed in, for example, the layer between thelayer including the upper end of the memory pillar MP and the layer inwhich the conductor 25 is provided. The lower end of the slit SLT isplaced in, for example, the layer in which the conductor 21A isprovided. In other words, for example, the lower end of the slit SLT isin contact with the conductor 21A instead of penetrating through theconductor 21A. The slit SLT contains an insulator such as silicondioxide (SiO₂).

The slit SHE is formed in a plate shape spreading along the XZ plane,and separates, for example, the conductor 24 and a part of the dummymemory pillars DMP. Specifically, the upper end of the slit SHE isplaced in, for example, the layer between the layer including the upperend of the memory pillar MP and the layer in which the conductor 25 isprovided. The lower end of the slit SHE is placed, for example, betweenthe layer in which the uppermost conductor 23 is provided and the layerin which the lowermost conductor 24 is provided. The slit SHE mayseparate at least all of the conductors 24 provided in the region. Theslit SHE contains an insulator such as silicon dioxide (SiO₂).

In the above-described configuration of the memory pillar MP, forexample, a portion where the memory pillar MP intersects the conductor22 functions as the select transistor ST2. Respective portions where thememory pillar MP intersects the plurality of conductors 23 function asthe memory cell transistors MT0 to MT7. Respective portions where thememory pillar MP intersects the plurality of conductors 24 function asthe select transistors ST1 a to ST1 c.

In other words, the conductor 31 in the memory pillar MP functions as achannel of each of the memory cell transistor MT, and the selecttransistors ST1 and ST2. The insulating film 34 functions as a chargestorage layer of the memory cell transistor MT.

FIG. 9 illustrates an example of a cross-sectional structure of thememory cell array 10 in a region corresponding to the dummy block DBLKin the cell region CA.

As illustrated in FIG. 9, the region corresponding to the dummy blockDBLK in the cell region CA includes, for example, the conductors 21A and21B, and 22 to 25, the memory pillars MP, the dummy memory pillars DMP,and the slits SLT and SHE. The structure of the dummy block DBLK is thesame as a structure in which, for example, the contact CH is omittedfrom the active block ABLK.

For example, the dummy block DBLK in the cell region CA does notpreferably include the contact CH in the active block ABLK, but mayinclude the contact CH. In other words, in the dummy block DBLK, thememory pillar MP may or not be electrically connected to the conductor25.

In the active block ABLK, the memory pillar MP may be electricallyconnected to the conductor 25 via two or more contacts, and may beelectrically connected thereto via other wirings. In this case, in thedummy block DBLK, the same contact and wiring as those in the activeblock ABLK may be formed between the memory pillar MP and the conductor25, and a structure in which some of the contacts and the wiringsprovided in the active block ABLK are omitted may be formed. The memorypillar MP may be provided in the dummy block DBLK in the same as in theactive block ABLK, and may not be provided.

Structure of Memory Cell Array 10 in Lead Region HA

FIG. 10 illustrates an example of a planar layout of the lead region HAof the memory cell array 10 of the semiconductor memory 1 according tothe embodiment by extracting one active block ABLK and one dummy blockDBLK.

As illustrated in FIG. 10, in the region of the active block ABLK in thelead region HA, a plurality of conductors respectively corresponding tothe select gate line SGS, the word lines WL0 to WL7, and the select gateline SGD have portions (terrace portions) not overlapping overlyingconductors.

For example, a plurality of conductors 24 respectively corresponding tothe select gate lines SGDa, SGDb, and SGDc are provided in a steppedform in which a step difference is formed in the X direction. In thelead region HA, the horizontal-direction slit SLT in the active blockABLK separates the select gate lines SGDa, SGDb, and SGDc. The slit SHEalso separates the select gate lines SGDa, SGDb, and SGDc.

In this example, in the active block ABLK, each of the select gate linesSGDa, SGDb, and SGDc is separated into four lines by the slits SLT andSHE. The four separated select gate lines SGD (that is, a set of SGDa,SGDb, and SGDc) respectively correspond to the string units SU0 to SU3.

For example, a plurality of conductors 23 respectively corresponding tothe word lines WL0 to WL7 have a step difference of one step in the Ydirection and are provided in a stepped shape of two rows in which astep difference is formed in the X direction. The slit separation partDJ provided in the horizontal-direction slit in the active block ABLK isdisposed in, for example, the terrace portion of the word line WL7. Theword lines WL provided in an identical layer in the identical activeblock ABLK are short-circuited to each other via the slit separationpart DJ.

The conductor 22 corresponding to the select gate line SGS is led in theX direction from, for example, end part regions of the word lines WL0and WL1. The horizontal-direction slit SLT in the active block ABLK mayor not separate the select gate line SGS.

In the active block ABLK, for example, contacts CC are provided in theterrace portions of the select gate line SGS, the word lines WL0 to WL7,and the select gate lines SGDa, SGDb, and SGDc.

For example, a C3 connection region C3tap is provided in an end partregion in the X direction in a region between the twohorizontal-direction slits SLT in contact with the active block ABLK.The C3 connection region C3tap is a region in which a contact (notillustrated) for connecting a wiring provided on the memory cell array10 to a wiring provided under the memory cell array 10 is provided.

Each of the select gate line SGS, the word lines WL0 to WL7, and theselect gate line SGD is electrically connected to the row decoder module15 provided under the memory cell array 10 via a contact penetratingthrough the corresponding contact CC and the C3 connection region C3tap.

The C3 connection region C3tap may be provided outside the regioninterposed between the horizontal-direction slits SLT. In the leadregion HA, the horizontal-direction slit SLT provided between the blocksBLK adjacent to each other may separate at least the conductor 22corresponding to the select gate line SGS. Thus, the C3 connectionregion C3tap interposed between the horizontal-direction slits SLT maynot be provided depending on a layout of the memory cell array 10.

The rest of the planar layout of the dummy block DBLK in the lead regionHA is the same as a planar layout obtained by reversing the planarlayout of the active block ABLK adjacent thereto, and thus a descriptionthereof will be omitted.

FIG. 11 illustrates a cross-sectional view of the memory cell array 10taken along the line IX-IX in FIG. 10, and illustrates an example of across-sectional structure of the memory cell array 10 in the regioncorresponding to the active block ABLK in the lead region HA.

As illustrated in FIG. 11, the region corresponding to the active blockABLK in the lead region HA includes, for example, the conductors 21A and21B, and 22 to 24, conductors 40 to 44, and contacts CC, V1, and C3.

The end part of each of the conductor 22, the conductor 23, and theconductor 24 respectively corresponding to the select gate line SGS, theword line WL, and the select gate line SGD is provided in a stepped formas described above. In other words, in the lead region HA, each end partof the conductors 22 to 24 has at least a portion not overlapping theoverlying conductor 23 or conductor 24.

The end part of the conductor 21B is led to the outside of the conductor22 in the lead region HA. In other words, in a plan view, the region inwhich the conductor 21B includes the region in which the conductor 22 isprovided. The end part of the conductor 21A is provided further inwardthan, for example, the conductor 21B. The conductor 21A may be providedin at least the cell region CA.

Each contact CC is formed in a columnar shape extending in the Zdirection. The contact CC includes, for example, a conductor formed in acolumnar shape. A spacer may be provided on a side surface of thecolumnar conductor provided in the contact CC. The conductor in thecontact CC contains, for example, tungsten (W), and the spacer contains,for example, silicon dioxide (SiO₂). In an embodiment, a contact CC inthe plane PN1 (see FIG. 3) may be referred to as a columnar firstcontact, and a contact CC in the plane PN2 (see FIG. 3) may be referredto as a columnar second contact.

The respective conductors 40 to 44 are wirings connecting the conductors22 to 24 led to the lead region HA from the cell region CAabove-described the row decoder module 15 to each other. A plurality ofconductors 40 are respectively provided on a plurality of contacts CC. Aplurality of contacts V1 are respectively provided on the plurality ofconductors 40. A plurality of conductors 41 are respectively provided onthe plurality of contacts V1.

The conductor 41 is electrically connected to, for example, thecorresponding conductor 42. The conductor 42 is electrically connectedto the conductor 43 provided in the same layer as the conductor 40 via,for example, the contact V1 in the C3 connection region C3tap. Theconductor 43 is electrically connected to the conductor 44 provided in alower layer of the conductor 21 via, for example, the contact C3 in theC3 connection region C3tap. The conductor 44 is electrically connectedto the row decoder module 15 via a contact and a wiring (notillustrated).

The conductors 40 and 43 may be formed in an identical layer, and may beformed in different layers. The conductors 41 and 42 may be formed in anidentical layer, and may be formed in different layers. Thecorresponding conductors 40 and 41 may be connected to each other via aplurality of contacts, and different wirings may be connected to eachother among a plurality of contacts.

In FIG. 11, the placement of the slit SHE provided in the depthdirection of the cross-sectional view is illustrated by a dashed line.As illustrated in FIG. 11, the slit SHE in the active block ABLK isprovided to separate the plurality of conductors 24 respectivelycorresponding to the select gate lines SGDa, SGDb, and SGDc in the leadregion HA.

FIG. 12 illustrates an example of a cross-sectional structure of thememory cell array 10 in the region corresponding to the dummy block DBLKin the lead region HA.

As illustrated in FIG. 12, the region corresponding to the dummy blockDBLK in the lead region HA includes, for example, the conductors 21A and21B, and 22 to 24, the conductors 40 to 45, and the contacts CC, V1, V2,and C3.

The conductor 45 is used as, for example, a micro-pad. The micro-pad isa pad used in, for example, an inspection process. The conductor 45 iselectrically connected to the corresponding conductor 42 via the contactV2. In other words, various wirings led in the dummy block DBLK areelectrically connected to, for example, the micro-pad.

In FIG. 12, the placement of the slit SHEs provided in the depthdirection of the cross-sectional view is illustrated by a dashed line.As illustrated in FIG. 12, in the lead region HA, the slit SHEs in thedummy block DBLK is provided to separate the plurality of conductors 24respectively corresponding to the select gate lines SGDa, SGDb, andSGDc.

The rest of the structure of the dummy block DBLK in the lead region HAis the same as, for example, the structure of the active block ABLK inthe lead region HA, and thus a description thereof will be omitted.

The conductors 45 and 42 may be connected to each other via positioncontacts and wirings. The conductor 45 may be exposed to a chip surfaceof the semiconductor memory 1. The various wirings led in the dummyblock DBLK may or not be connected to circuits provided in a lower layerof the conductor 21. In other words, in the dummy block DBLK, theconductors 43 and 44, and the contact C3 may be omitted.

In the above description, a description has been made of an exemplarycase where the word line WL of the active block ABLK is connected to therow decoder module 15 under the memory cell array 10 via the C3connection region C3tap, but this is only an example. For example, thecontact CC connected to the end part of the conductor 23 (that is, theword line WL) may be electrically connected to the row decoder module 15under the memory cell array 10 via a contact which penetrates throughstacked wirings (for example, a plurality of conductors 23) of the dummyblock DBLK in the lead region HA.

The contact CC connected to the end part of the conductor 23 may beelectrically connected to the row decoder module 15 under the memorycell array 10 via a contact which penetrates through stacked wirings(for example, a plurality of conductors 23) of the active block ABLK inthe lead region HA. In a case where the horizontal-direction slit SLT isprovided at the other end part of the block group BLKG in the Xdirection, the C3 connection region C3tap may be provided in a regionoutside the region surrounded by the vertical-direction slit and thehorizontal-direction slit.

Structure of Memory Cell Array 10 in Vicinity of Plane Separation RegionPNdiv

FIG. 13 illustrates an example of a planar layout of the vicinity of theplane separation region PNdiv of the semiconductor memory 1 according tothe embodiment by extracting one active block ABLK and one dummy blockDBLK. In the following, the C4 connection region C4tap of the plane PN1will be focused.

As illustrated in FIG. 13, in the C4 connection region C4tap, aplurality of conductors 24 respectively corresponding to the select gatelines SGDa, SGDb, and SGDc and the conductor 23 corresponding to theuppermost word line WL have portions (terrace portions) not overlappingoverlying conductors.

For example, in the active block ABLK, the plurality of conductors 24respectively corresponding to the select gate lines SGDa, SGDb, and SGDcare provided in a stepped form in which a step difference is formed inthe X direction. In the C4 connection region C4tap, thehorizontal-direction slit SLT in the active block ABLK separates theselect gate lines SGDa, SGDb, and SGDc. Similarly, the slit SHEseparates the select gate lines SGDa, SGDb, and SGDc.

The horizontal-direction slit SLT disposed in the active block ABLK isnot in contact with the vertical-direction slit SLT. In other words, theword lines WL provided in an identical layer in the C4 connection regionC4tap are short-circuited to each other in the string units SU0 to SU3.

The rest of the planar layout of the dummy block DBLK in the C4connection region C4tap is the same as a planar layout obtained byreversing the planar layout of the active block ABLK adjacent thereto,and thus a description thereof will be omitted.

FIG. 14 illustrates a cross-sectional view of the memory cell array 10taken along the line XIV-XIV in FIG. 13, and illustrates an example of across-sectional structure of the memory cell array 10 including a regioncorresponding to the active block ABLK in the vicinity of the planeseparation region PNdiv. In the following, the C4 connection regionC4tap of the plane PN1 will be focused.

As illustrated in FIG. 14, the region corresponding to the active blockABLK in the C4 connection region C4tap includes, for example, theconductors 21A and 21B, and 22 to 24, conductors 47, 48, and 50, andcontacts CS and C4.

The end part of the conductor 21A in the plane PN1 extends, for example,from the cell region CA to the middle of the C4 connection region C4tap.On the other hand, the end part of the conductor 21B extends, forexample, to the middle of the plane separation region PNdiv, and isseparated by the vertical-direction slit SLT. The same is true for theconductor 21B in the plane PN2. The end part of the conductor 21B thatextends from the plane PN1 and is provided in the plane separationregion PNdiv may be referred to as a first conductive layer 21B-1. Theend part of the conductor 21B that extends from the plane PN2 and isprovided in the plane separation region PNdiv may be referred to as asecond conductive layer 21B-2.

The conductor 21B corresponding to the plane PN1 and the conductor 21Bcorresponding to the plane PN2 are separated from each other in theplane separation region PNdiv. In other words, an insulator is providedbetween the conductor 21B of the plane PN1 and the conductor 21B of theplane PN2.

In the following, the region in which the conductor 21B of the plane PN1and the conductor 21B of the plane PN2 are separated from each otherwill be referred to as a source line separation region DPdiv. In otherwords, the source line separation region DPdiv is provided in the regionbetween the region in which the conductor 21B of the plane PN1 isprovided and the region in which the conductor 21B of the plane PN2 isprovided.

Each of the conductors 22 and 23 are separated by the vertical-directionslit SLT, and is in contact with the vertical-direction slit SLT. Aplurality of conductors 24 respectively corresponding to the select gatelines SGDa, SGDb, and SGDc are provided, for example, in a stepped formin the same manner as in the lead region HA. This is only an example,and, in the C4 connection region C4tap, the plurality of conductors 24respectively corresponding to the select gate lines SGDa, SGDb, and SGDcmay not be provided in a stepped form. In an embodiment, the conductor21B, the insulating layers 26, and the conductors 23 in the plane PN1may be referred to as a first conductor, first insulators, and secondconductors, respectively, and a group thereof may be referred to as afirst stacked body. Similarly, the conductor 21, the insulating layers26, and the conductors 23 in the plane PN2 may be referred to as a thirdconductor, second insulators, and fourth conductors, respectively, and agroup thereof may be referred to as a second stacked body.

In the C4 connection region C4tap, the columnar contact CS is providedon the conductor 21, and the contact CS includes a conductor 46 and aspacer SP. The conductor 46 is provided in a columnar shape, and a lowerend thereof is in contact with the conductor 21B. The conductor 46 isnot limited thereto, and the lower end thereof may be placed in thelayers in which the conductors 21A and 21B are provided, and may be incontact with the conductor 21A. The spacer SP is provided on a sidesurface of the conductor 46.

The conductor 47 is provided on the contact CS, that is, on theconductor 46. The conductor 47 is electrically connected to, forexample, the conductor 48 provided in an identical layer in the C4connection region C4tap.

The conductor 48 is electrically connected to the conductor 50 providedin a lower layer of the conductor 21 via the contact C4. The contact C4includes a conductor 49 and a spacer SP, and penetrates through, forexample, the conductors 21B, 22, and 23. The conductor 49 is provided ina columnar shape, and has a lower end in contact with the conductor 50and an upper end in contact with the conductor 48. The spacer SP isprovided on a side surface of the conductor 49. The conductor 50 iselectrically connected to a circuit provided under the memory cell array10.

In FIG. 14, a set of the contacts CS and C4 is illustrated, but the C4connection region C4tap may include a plurality of contacts CS and C4,and may include a plurality of conductors 47, 48, and 50. In this case,the conductor 21 is electrically connected to the correspondingconductor 50 via a combination of the contacts CS and C4 and theconductors 47 and 48.

A wiring layer in which the conductor 23 is provided includes a region(for example, an ON region) in which insulators 51 are provided, in theregion (that is, the plane separation region PNdiv) between thevertical-direction slit corresponding to the plane PN1 and thevertical-direction slit corresponding to the plane PN2. The insulators51 are provided in a portion separated from the slit SLT. Each of theinsulators 51 contains, for example, silicon nitride (SiN).

In an embodiment, the first conductive layer 21B-1, the insulatinglayers 26, and the conductors 23 in a region between the ON region andthe slit SLT adjacent to the plane PN1 may be referred to as a fifthconductor, fourth insulators, and sixth conductors, respectively, and agroup thereof may be referred to as a third stacked body. Similarly, thesecond conductive layer 21B-2, the insulating layers 26, and theconductors 23 in a region between the ON region and the slit SLTadjacent to the plane PN2 may be referred to as a seventh conductor,fifth insulators, and eighth conductors, respectively, and a groupthereof may be referred to as a fourth stacked body. Further, the slitSLT adjacent to the plane PN1 and the slit SLT adjacent to the plane PN2may be referred to as a third insulator and a sixth insulator,respectively. Furthermore, a portion of the source line separationregion DPdiv, insulating layers 26, and the insulators 51 in the ONregion may be referred to as a seventh insulator, eighth insulators, andninth insulators, respectively, and a group thereof may be referred toas a fifth stacked body.

In FIG. 14, the placement of the slit SHE provided in a depth directionof the cross-sectional view is illustrated by a dashed line. Asillustrated in FIG. 14, the slit SHE in the active block ABLK isprovided to separate the plurality of conductors 24 respectivelycorresponding to the select gate lines SGDa, SGDb, and SGDc in the C4connection region C4tap.

FIG. 15 is a cross-sectional view of the memory cell array 10 along theY direction, and illustrates an example of a cross-sectional structureof the memory cell array 10 including a peripheral region of the blockgroup BLKG and a region of the dummy block DBLK.

As illustrated in FIG. 15, each of the conductors 22, 23, and 24 isseparated by the slit SLT between the dummy block DBLK and theperipheral region of the block group BLKG. In other words, each of theconductors 23 corresponding to the word lines WL0 to WL7 provided in thedummy block DBLK is insulated from the conductor 23 provided in anidentical layer in the peripheral region.

An ON region is formed in a portion of the peripheral region separatedfrom the slit SLT. Specifically, in the ON region, insulators 51 areprovided in layers in which the conductors 23 and 24 are provided. Forexample, dummy steps are formed in the peripheral region. The dummysteps are stepped portions formed when stepped portions of the leadregion HA are processed. In this example, the dummy steps are formed inthe ON region of the peripheral region, and a plurality of insulators 51are provided in a stepped form.

In the peripheral region, the end part of the conductor 21B is led to,for example, the outside of the dummy steps. In other words, in a planview, the region in which the conductor 21B is provided includes theregion in which the conductor 22 is provided. This is only an example,and a region in which the conductor 21B is provided may include at leasta region in which the W region is formed in a plan view.

The end part of the conductor 21A is provided further inward than theend part of the conductor 21B. The conductor 21A may be provided up toat least a location in contact with the horizontal-direction slit SLTbetween the dummy block DBLK and the peripheral region, and a rangethereof formed in the peripheral region may be designed to be any range.

The rest of the structure of the dummy block DBLK in the C4 connectionregion C4tap is the same as, for example, the structure of the activeblock ABLK in the C4 connection region C4tap, and thus a descriptionthereof will be omitted. In the above description, the structure of thememory cell array 10A corresponding to the plane PN1 has been described,and a structure of the plane PN2 is the same as a structure obtained byreversing, for example, the structure of the plane PN1 with the Ydirection as a symmetry axis, and thus a description thereof will beomitted.

FIG. 16 illustrates a planar layout of the memory cell array 10 byextracting each of the block groups BLKG adjacent to each other betweenthe planes PN1 and PN2. In FIG. 16, the ON region and the W region inthe regions are hatched differently. The W region illustrated in FIG. 16corresponds to a region in which, for example, the conductor 23corresponding to the word line WL0 is provided.

As illustrated in FIG. 16, for example, the block groups BLKG adjacentto each other between the planes PN1 and PN2 are interposed between theregion of the dummy steps provided on one side in the Y direction andthe BL connection region BLtap provided on the other side in the Ydirection. In other words, the W region provided in each of the planesPN1 and PN2 is, for example, in contact with the region of the dummysteps on one side in the Y direction and is in contact with the BLconnection region BLtap on the other side in the Y direction. In theplane separation region PNdiv, the W region of each of the planes PN1and PN2 is provided along the vertical-direction slit SLT in contactwith the plane separation region PNdiv.

The ON region is provided between the W region of the plane PN1 and theW region of the plane PN2. As described above, in the embodiment, theconductor 23 in the plane PN1 is insulated from the conductor 23 in theplane PN2. The above-described structure is similarly formed for theother word lines WL1 to WL7.

FIG. 16 illustrates a region DP1 in which the conductor 21Bcorresponding to the plane PN1 is provided and a region DP2 in which theconductor 21B corresponding to the plane PN2 is provided. The sourceline separation region DPdiv is provided between the region DP1 and theregion DP2, and the regions DP1 and DP2 are separated from each other.

In the structure of the memory cell array 10 described above, the numberof conductors 23 is designed based on the number of word lines WL. Aplurality of conductors 22 provided in a plurality of layers may beallocated to the select gate lines SGS. In a case where the select gatelines SGS are provided in a plurality of layers, a conductor which isdifferent from the conductor 22 may be used.

A region of dummy steps may be provided between the dummy block DBLK andthe BL connection region BLtap provided on the other side in the Ydirection. For example, in a case where a region of dummy steps is notprovided between the dummy block DBLK and the BL connection regionBLtap, for example, the same stacked structure as in the ON region isformed in the BL connection region. In this case, for example, thecontact C4 penetrating through the stacked structure is provided in theBL connection region BLtap, and thus the bit line BL is electricallyconnected to a wiring under the memory cell array 10.

On the other hand, in a case where a region of dummy steps is providedbetween the dummy block DBLK and the BL connection region BLtap, forexample, the same insulating layer as in the C3 connection region C3tapis formed in the BL connection region. In this case, for example, thecontact C3 penetrating through the insulating layer is provided in theBL connection region BLtap, and thus the bit line BL is electricallyconnected to a wiring under the memory cell array 10.

1-2. Effect of Embodiment

According to the semiconductor memory 1 of the embodiment describedabove, it is possible to improve data stored in a memory cell. In thefollowing, details of the effect will be described.

In a manufacturing process for a semiconductor memory in which memorycells are stacked in a three-dimensional manner, in a case where astacked wiring such as the word line WL is formed, first, a stacked bodyin which a replacement member and an insulating film are alternatelystacked is formed. For example, a slit for partitioning the block BLK isformed, and removal of the replacement member and formation of aconductor are performed in order by using the slit. Thereafter, forexample, an insulator is buried in the slit. A stacked wiring formedthrough the replacement process is used as a wiring such as the wordline WL connected to a NAND string.

A slit used for a replacement process on the word line WL may also beused for a replacement process on the source line SL. FIG. 17illustrates examples of stacked structures before and after areplacement process on the source line SL in a case where the sourceline SL is formed through the replacement process using a slit.

As illustrated in “before replacement process” FIG. 17, in a source lineportion before a replacement process, for example, a conductor 60, aninsulator 61, a sacrifice member 62 (also referred to as a replacementmember 62), an insulator 63, and a conductor 64 are stacked in order.Each of the conductor 60, the insulator 61, the sacrifice member 62, theinsulator 63, and the conductor 64 may be processed to a different shapein regions other than the cell region CA.

The conductors 60 and 64 are, for example, poly-silicon, and theconductor 64 corresponds to the conductor 21B. Each of the insulators 61and 63 is, for example, silicon dioxide (SiO₂) or silicon nitride (SiN),and employs a material causing the etch selectivity to the sacrificemember 62 to be high. The sacrifice member 62 is, for example,poly-silicon.

In the stacked structure of the source line portion, a bottom part ofthe memory pillar MP is formed to be placed in, for example, a layer inwhich the conductor 60 is formed. A bottom part of a slit used for thereplacement process is formed to be in contact with at least thesacrifice member 62.

In the replacement process on the source line SL, first, the sacrificemember 62 is removed via a slit, and the stacked film 32 formed on theexposed side surface part of the memory pillar MP is removed. In aprocess of removing the stacked film 32, for example, the insulators 61and 63 are also removed. A conductor (for example, poly-silicon)corresponding to the source line SL is formed in a space from which thesacrifice member 62 and the insulators 61 and 63 are removed.

As a result, as illustrated in “after replacement process” in FIG. 17,for example, the conductor 21A is formed in the layers in which theconductor 60, the insulators 61 and 63, and the replacement member 62are formed. Each of the conductors 21A and 21B is, for example,poly-silicon, and the conductors 21A and 21B are made of an identicalmaterial, and thus may be integrally formed.

The conductor 64 (that is, the conductor 21B) described above may beused as, for example, a protection film. Specifically, for example, in aprocess of removing the sacrifice member 62, the conductor 64 canprevent a short circuit failure between the source line SL and theselect gate line SGS which may occur when a region near the conductor 22is etched via the region from which the sacrifice member 62 is removed.

For that reason, the conductor 64 is preferably provided to protectstacked wirings close to the slit SLT. In other words, in thesemiconductor memory 1, the conductor 21B is formed in a range widerthan, for example, the conductor 22 corresponding to the lowermostwiring among the stacked wirings.

For example, in a case where planes are adjacent to each other and sharea structural body of stacked wirings, there may be a structure in whichthe conductor 64 is continuously formed in the planes adjacent to eachother or via peripheral regions of the planes, and thus the source linesSL are electrically connected to each other in the planes. Even in thiscase, the semiconductor memory is operable, but a noise component of thesource line SL increases, and thus the reliability of data stored in amemory cell may be reduced.

In contrast, the slit SLT may be provided between planes adjacent toeach other such that the conductors 21B of the planes adjacent to eachother are separated from each other. However, also in this case, theconductor 21B is left without being separated in peripheral regions (forexample, a region of dummy steps) of the planes, and the conductors 21Bin the planes adjacent to each other are electrically connected to eachother via the peripheral regions of the planes.

In the semiconductor memory 1 according to the embodiment, in astructure in which two planes PN1 and PN2 are adjacent to each other,the conductor 21B in the plane PN1 is provided separate from theconductor 21B in the plane PN2. Specifically, the region DP1 of theconductor 21B in the plane PN1 is separated from the region DP2 of theconductor 21B in the plane PN2 by the source line separation regionDPdiv.

For example, the source line separation region DPdiv is formed, forexample, after a stacked structure of the source line portion includingthe sacrifice member 62 is formed and before the conductor 22corresponding to the select gate line SGS is provided. In other words,the regions DP1 and DP2 are separated from each other through an etchingprocess which is different from processing on the slit SLT. In thesemiconductor memory 1 according to the embodiment, the source lineseparation region DPdiv is formed in advance as described above, andthus the conductors 21B in the planes adjacent to each other can bereliably separated from each other.

Consequently, the semiconductor memory 1 according to the embodiment hasa structure in which the conductors 21A and 21B in the plane PN1 areelectrically insulated from the conductors 21A and 21B in the plane PN2.Therefore, the semiconductor memory 1 according to the embodiment canprevent an increase in a noise component of the source line SL and canthus improve the reliability of data stored in a memory cell.

The semiconductor memory 1 according to the embodiment has a structurein which the two planes PN1 and PN2 (that is, the memory cell arrays 10Aand 10B) are adjacent to each other in the X direction. In the planesPN1 and PN2, the C4 connection region C4tap is provided in the portionin contact with the plane separation region PNdiv between the two planesPN1 and PN2. In other words, in the semiconductor memory 1 according tothe embodiment, the lead region HA of each of the planes PN1 and PN2 isprovided on only one side in the X direction.

As a result, in the semiconductor memory 1 according to the embodiment,it is possible to reduce an area occupied by the lead region HA comparedwith a case where two planes in which the lead regions HA have a steppedstructure are adjacent to each other on both sides in the X direction.Therefore, the semiconductor memory 1 according to the embodiment canprevent an increase in the chip area of the semiconductor memory 1having a plurality of planes.

2. Modification Example and the Like

The semiconductor memory of the embodiment includes first to seventhregions, first and second active regions, first to fourth stackedbodies, first and second contacts, and first and second pillars. Thefirst to seventh regions are arranged in order on one side in a firstdirection. The first active region (for example, ABLK of 10A in FIG. 16)includes a part of each of the first to third regions. The second activeregion (for example, ABLK of 10B in FIG. 16) includes a part of each ofthe fifth to seventh regions. The first stacked body includes a firstconductor (for example, 21B of PN1 in FIG. 14) in a first layer, and afirst insulator and a second conductor alternately stacked on the firstconductor, in the first active region. The second stacked body includesa third conductor (for example, 21B of PN2 in FIG. 14) in the firstlayer, and a second insulator and a fourth conductor alternately stackedon the third conductor, in the second active region. The first contactis provided in a columnar shape on a second conductor in a second layeramong the stacked second conductors in the first region. The secondcontact is provided in a columnar shape on a fourth conductor in thesecond layer among the stacked fourth conductors in the seventh region.Each of a plurality of first pillars (for example, MP) penetratesthrough the stacked first conductors in the second region (for example,CA of PN1 in FIG. 3), and a portion thereof intersecting the firstconductor functions as a memory cell. Each of a plurality of secondpillars (for example, MP) penetrates through the stacked fourthconductors in the sixth region (for example, CA of PN2 in FIG. 3), and aportion thereof intersecting the fourth conductor functions as a memorycell. The third stacked body includes a fifth conductor adjacent to thefirst conductor via a third insulator (for example, SLT in FIG. 14) inthe first layer of the fourth region, and a fourth insulator and a sixthconductor alternately stacked on the fifth conductor. The fourth stackedbody includes a seventh conductor adjacent to the third conductor via afifth insulator (for example, SLT in FIG. 14) in the first layer of thefourth region, and a sixth insulator and an eighth conductor alternatelystacked on the seventh conductor. The fifth conductor is electricallyinsulated from the seventh conductor (for example, DPdiv in FIG. 14).Consequently, in the semiconductor memory according to the embodiment,it is possible to improve the reliability of data stored in a memorycell.

In the structure of the memory cell array 10 described in theembodiment, the memory pillar MP may have a structure in which aplurality of pillars are connected to each other in the Z direction. Forexample, the memory pillar MP may have a structure in which a pluralityof pillars each penetrating through a plurality of conductors 23 areconnected to each other in the Z direction. The memory pillar MP mayhave a structure in which a pillar penetrating through the conductors 22and 23 and a pillar penetrating through the conductor 24 are connectedto each other. In this case, the slit SLT does not separate, forexample, the conductor 24, and the conductor 24 is separated by a slitwhich is different from the slit SLT.

In the embodiments, a description has been made of an exemplary casewhere the word lines WL form steps of two rows in the lead region HA,but this is only an example. For example, in the lead region HA, endparts of the word lines WL may be formed in a step of one row, and maybe formed in steps of three or more rows.

In the embodiments, a description has been made of an exemplary casewhere the region of the memory cell array 10 includes a single C4connection region C4tap, but a plurality of C4 connection regions C4tapmay be provided in the cell region CA. The number of C4 connectionregions C4tap inserted into the cell region CA may be designed to be anynumber.

In the embodiments, a description has been made of an example in whichthe contacts CS and C4 are provided in the C4 connection region C4tapadjacent to the plane separation region PNdiv, but the contacts CS andC4 may not be provided in the C4 connection region C4tap adjacent to theplane separation region PNdiv. At least a terrace portion of each selectgate line SGD may be formed in the C4 connection region C4tap adjacentto the plane separation region PNdiv.

In the embodiment, a description has been made of an exemplary casewhere the W region of the plane PN1 and the W region of the plane PN2are separated from each other in the plane separation region PNdiv, butthe W region of the plane PN1 and the W region of the plane PN2 may becontinuously formed.

FIG. 18 illustrates an example of a planar layout of the memory cellarrays 10A and 10B in a first modification example of the embodiment,and FIG. 19 illustrates a cross-sectional structure of the memory cellarrays 10A and 10B in the first modification example of the embodiment.

As illustrated in FIG. 18, in the first modification example, a gapbetween the memory cell array 10A corresponding to the plane PN1 and thememory cell array 10B corresponding to the plane PN2 is designed to benarrower than in the embodiment.

Thus, a gap between the vertical-direction slit SLT in the memory cellarray 10A and the vertical-direction slit SLT in the memory cell array10B is narrow, and thus the W region corresponding to the memory cellarray 10A and the W region corresponding to the memory cell array 10Bare continuously formed.

Specifically, as illustrated in FIG. 19, each conductor 23 provided inthe plane separation region PNdiv is continuously provided between thevertical-direction slit SLT in contact with the plane PN1 and thevertical-direction slit SLT in contact with the plane PN2. Even in thiscase, in the semiconductor memory 1 in the first modification example,it is possible to achieve the same effect as in the embodiment byproviding the source line separation region DPdiv in the same manner asin the embodiment.

FIG. 20 illustrates an example of a planar layout of the memory cellarrays 10A and 10B in a second modification example of the embodiment,and FIG. 21 illustrates a cross-sectional structure of the memory cellarrays 10A and 10B in the second modification example of the embodiment.

As illustrated in FIG. 20, in the second modification example, withrespect to the semiconductor memory 1 according to the embodiment, astitch-shaped slit SLTs is provided between the memory cell array 10Acorresponding to the plane PN1 and the memory cell array 10Bcorresponding to the plane PN2.

Thus, the replacement member 62 between the vertical-direction slit SLTin the memory cell array 10A and the vertical-direction slit SLT in thememory cell array 10B is replaced with the conductor 23, and thus the Wregion corresponding to the memory cell array 10A and the W regioncorresponding to the memory cell array 10B are continuously formed.

Specifically, as illustrated in FIG. 21, for example, the slit SLTs isprovided to pass through the source line separation region DPdiv. Theslit SLTs is not limited thereto, and may be in contact with theconductor 21B of the memory cell array 10A, and may be in contact withthe conductor 21B of the memory cell array 10B.

Even in this case, in the semiconductor memory 1 in the secondmodification example, it is possible to achieve the same effect as inthe embodiment by providing the source line separation region DPdiv inthe same manner as in the embodiment.

In the embodiment and the modification examples, a description has beenmade of an exemplary case where the source line separation region DPdivis provided in the plane separation region PNdiv, but this is only anexample. The source line separation region DPdiv may be formed in the C4connection region C4tap close to the plane separation region PNdiv inthe plane PN1, and may be formed in the C4 connection region C4tap closeto the plane separation region PNdiv in the plane PN2.

In other words, the source line separation region DPdiv may be providedin at least a region between the cell region CA of the plane PN1 and thecell region CA of the plane PN2, so as to separate the conductor 21Bbetween the planes PN1 and PN2.

In the semiconductor memory 1 according to the embodiment, whether theblock BLK provided in the memory cell array 10 is the dummy block DBLKor the active block ABLK may be determined based on whether or not ablock address BAd is allocated thereto.

Specifically, the block address BAd is not allocated to the dummy blockDBLK, and the block address BAd is allocated to the active block ABLK.For example, in a case where blocks are accessed in order whileincreasing the block address BAd by one, the block BLK which is notaccessed at all may be determined as being the dummy block DBLK.

The term “connection” in the present specification indicates thatelements are electrically connected to each other, and includes that theelements are electrically connected to each other via other elements.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A semiconductor memory comprising: a firststacked body including a first conductor and an alternating stack offirst insulators and second conductors above the first conductor, thefirst stacked body including first and second regions in order along afirst direction crossing a stacking direction of the first stacked body;a second stacked body including a third conductor and an alternatingstack of second insulators and fourth conductors above the thirdconductor, the second stacked body including third and fourth regions inorder along the first direction; a columnar first contact provided on alowermost conductor among the second conductors in the first region; acolumnar second contact provided on a lowermost conductor among thefourth conductors in the fourth region; a plurality of first pillars,each of the first pillars extending through the first stacked body inthe second region, and including memory cell regions at intersectionswith the second conductors; a plurality of second pillars, each of thesecond pillars extending through the second stacked body in the thirdregion, and including memory cell regions at intersections with thefourth conductors; a third stacked body provided between the firststacked body and the second stacked body, the third stacked bodyincluding a fifth conductor and an alternating stack of fourthinsulators and sixth conductors above the fifth conductor; a thirdinsulator provided between the fifth conductor and the first conductor;a fourth stacked body provided between the third stacked body and thesecond stacked body, the fourth stacked body including a seventhconductor and an alternating stack of fifth insulators and eighthconductors above the seventh conductor; a sixth insulator providedbetween the seventh conductor and the third conductor; and a fifthstacked body provided between the third stacked body and the fourthstacked body, the fifth stacked body including a seventh insulator andan alternating stack of eighth insulators and ninth insulators above theseventh insulator, wherein the ninth insulators are in contact with thesixth conductors, respectively, and the eighth conductors, respectively.2. The semiconductor memory according to claim 1, wherein the thirdinsulator is in contact with each of the second conductors and each ofthe sixth conductors, and the sixth insulator is in contact with each ofthe fourth conductors and each of the eighth conductors.
 3. Thesemiconductor memory according to claim 1, wherein the third insulatoris in contact with each of the first insulators and each of the fourthinsulators, and the sixth insulator is in contact with each of thesecond insulators and each of the fifth insulators.
 4. The semiconductormemory according to claim 1, wherein the lowermost conductor among thesixth conductors is electrically insulated from the lowermost conductoramong the eighth conductors.
 5. The semiconductor memory according toclaim 1, wherein a lowermost conductor among the sixth conductors and alowermost conductor among the eighth conductors are continuouslyprovided.
 6. The semiconductor memory according to claim 1, wherein thelowermost conductor among the sixth conductors is electrically connectedto the lowermost conductor among the eighth conductors.
 7. Thesemiconductor memory according to claim 1, further comprising: a ninthconductor in contact with a lower surface of the first conductor; and atenth conductor in contact with a lower surface of the third conductor,wherein each of the plurality of first pillars includes a firstsemiconductor extending in a thickness direction, and a tenth insulatorcovering a bottom surface and a part of a side surface of the firstsemiconductor, each of the plurality of second pillars includes a secondsemiconductor extending in the thickness direction, and a eleventhinsulator covering a bottom surface and a part of a side surface of thesecond semiconductor, the ninth conductor is in contact with a sidesurface of the first semiconductor, and the tenth conductor is incontact with a side surface of the second semiconductor.
 8. Thesemiconductor memory according to claim 1, wherein the fifth conductorand the seventh conductor are at a same layer level.
 9. Thesemiconductor memory according to claim 1, wherein each of the firstconductor and the third conductor serves as a source line.
 10. Thesemiconductor memory according to claim 1, wherein each of the secondconductors serves as a word line and each of the fourth conductorsserves as a word line.
 11. The semiconductor memory according to claim1, further comprising: a first select gate line between the firstconductor and a lowermost insulator among the first insulators; and asecond select gate line between the third conductor and a lowermostinsulator among the second insulators.
 12. The semiconductor memoryaccording to claim 1, wherein the ninth insulators are at same layerlevels as the sixth conductors, respectively, and as the eighthconductors, respectively, and each of the ninth insulators electricallyseparates between one of the sixth conductors at a same layer level andone of the eighth conductors at the same layer level.
 13. Thesemiconductor memory according to claim 1, wherein the ninth insulatorsare formed of a nitride.
 14. The semiconductor memory according to claim1, wherein the ninth insulators are formed of silicon nitride.